See the Invisible World with Pemtron Inspection Equipment at SMTconnect 2023
April 10, 2023 | Pemtron TechnologyEstimated reading time: 1 minute

Pemtron Europe, an inspection equipment developer and supplier, will exhibit at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. See the invisible world in Hall 4, Stand 331 – Pemtron develops the best inspection equipment with the world’s best technology. Systems on display include the Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System and TROI 8800 CI Series Conformal Coating Inspection System.
Pemtron’s Saturn 3D Inline Solder Paste Inspection (SPI) System features Moiré technology, combining 2D color images with 3D measurement data. The result is more accurate and realistic 3D inspection images unlike conventional methods that display the solder paste through a color map only. With quad projection, 10/15 or 18um resolution a 4MP camera (optional 10MP) and three-stage conveyor (rail extensions optional), the Saturn is the most advanced 3D SPI system.
The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.
Also on the AOI side, Pemtron will showcase the TWIN 3D AOI system for top/bottom double-sided simultaneous inspection. Pemtron’s new head type has been upgraded for 3D formation that is identical to the real image and is more stable.
Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronic SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
08/26/2025 | ZESTRONZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA:
Pick and Place Machine Innovator - NECTEC Launches Next-Gen SMT Line Solution With LED and X-ray Technology
08/26/2025 | Globe NewswireNECTEC PTE. LTD., a leading provider of SMT electronics manufacturing equipment, announced the official launch of its next-generation SMT solutions, featuring newly upgraded pick and place machine, specialized LED pick and place machines, enhanced Reflow Oven technology, advanced X-ray Inspection, high-speed X-ray Counter, and premium Solder Paste
MS2 Technologies, LLC/P. Kay Focuses on Central America with First Installation in Honduras
08/24/2025 | P. Kay Metal, Inc.This year MS2 Technologies has turned their focused to the growing electronics market in Central America. With that focus came the adaptation of MS2 and the Akila System from a Honduras-based corporation with manufacturing plants in both Honduras and Mexico.
BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.