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See the Invisible World with Pemtron Inspection Equipment at SMTconnect 2023
April 10, 2023 | Pemtron TechnologyEstimated reading time: 1 minute

Pemtron Europe, an inspection equipment developer and supplier, will exhibit at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. See the invisible world in Hall 4, Stand 331 – Pemtron develops the best inspection equipment with the world’s best technology. Systems on display include the Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System and TROI 8800 CI Series Conformal Coating Inspection System.
Pemtron’s Saturn 3D Inline Solder Paste Inspection (SPI) System features Moiré technology, combining 2D color images with 3D measurement data. The result is more accurate and realistic 3D inspection images unlike conventional methods that display the solder paste through a color map only. With quad projection, 10/15 or 18um resolution a 4MP camera (optional 10MP) and three-stage conveyor (rail extensions optional), the Saturn is the most advanced 3D SPI system.
The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.
Also on the AOI side, Pemtron will showcase the TWIN 3D AOI system for top/bottom double-sided simultaneous inspection. Pemtron’s new head type has been upgraded for 3D formation that is identical to the real image and is more stable.
Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
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