-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Altus Assists PCB Specialists to Add Best-in-Class Inspection to its Production Line
April 11, 2023 | Altus GroupEstimated reading time: 2 minutes

To ensure quality and efficiency are implemented at all times and compete as a best-in-class CEM, Garner Osborne Circuits liaised with capital equipment supplier and service provider Altus to further enhance their inspection processes through 3D AOI technology.
False calls and escapes are unavoidable when using 2D inspection techniques. When manufacturing complex miniaturised PCBs, this assessment method cannot meet the high standards critical to the success and performance of modern electronic devices. Identifying defects early in assembly and having data to support process improvement decisions is vital to ensure quality. Therefore, moving away from 2D inspection methods to 3D AOI technology is crucial.
To take their inspections processes to a new level Altus introduced Garner Osborne to Koh Young Zenith Alpha HS+, the foremost true 3D AOI solution powered by AI enhanced high speed 3D measurement capabilities. The system incorporates KSMART technology which revolutionises data collection and analysis, and improves PCB process optimisation.
Steve Honeybun, CEM Operations Director, Garner Osborne, said: ‘’Garner Osborne has always had a philosophy of continuous improvement to consistently perform at the top end of electronic production services. Moving to a 3D light metrology process with Koh Young, who is widely regarded as the best inspection provider in the market, is a great reflection of that.
“We have worked with Altus for several years, and extending our partnership further, given the support they have always given us, made the decision easier. As a result, we now have fully 3D SPI and AOI to support improving our production yields, and we are delighted to get the unit up and running.’’
KSMART analysis collects all inspection and measurement data and helps advanced inspection systems evolve from “Pass/Fail” tools into highly intuitive, dynamic decision-making systems. Adept equipment supplies can then apply the data set to proprietary AI engines for continuous performance improvement. KSMART ensures the highest levels of transparency by showing all conditions of the lines, while providing the required documentation for changes to each job for traceability.
Anthony Oh, Altus Technical Applications Manager: ‘’This has been an excellent project for Altus, and we especially enjoy working with the team at Garner Osborne. Of course, we take each project as a standalone in its own right, and their team tested us, given that by upgrading to Koh Young, they moved away from an already trusted partner. I am pleased that we demonstrated our claims of providing the lowest levels of false calls available and showing the value of fully 3D light measurement data collection to improve yield. This aspect is where CEM customers can unlock value in their production environment and for their customers.’’
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.