Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
BTU to Introduce Next Gen Thermal Profiling Tool at SMTconnect 2023
April 11, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit in Hall 4A, Stand 210 at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. At the show, BTU will show its brand new Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source.
This exclusive tool by BTU measures dual temperature locations as well as vibration at real-time product temperature while the product completes its thermal path. Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, location on the path, and conditions at the product level as well as at the heat source.
Profile Tracer supports Industry 4.0 capabilities by acquiring data sets, enabling data communication, and increasing database analysis using In-One-Pass (I-O-P) technology. Profile Tracer software is part of the Wincon™ ecosystem of powerful diagnostic and analytical tools supporting overall process optimization.
Profile Tracer detects multiple variables affecting the thermal profile in one pass. Additionally, it reduces initial oven setup time and facilitates process optimization. The unit’s compact design, user-friendly software, modest cost, and integration into the BTU system, contribute to overall reduction in the total Cost of Ownership.
Share on:
Suggested Items
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Smart Automation: The Power of Data Integration in Electronics Manufacturing
06/24/2025 | Josh Casper -- Column: Smart AutomationAs EMS companies adopt automation, machine data collection and integration are among the biggest challenges. It’s now commonplace for equipment to collect and output vast amounts of data, sometimes more than a manufacturer knows what to do with. While many OEM equipment vendors offer full-line solutions, most EMS companies still take a vendor-agnostic approach, selecting the equipment companies that best serve their needs rather than a single-vendor solution.
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight TechnologiesKeysight Technologies, Inc. in collaboration with NTT Corporation and NTT Innovative Devices Corporation (NTT Innovative Devices), today announced a groundbreaking world record in data rate achieved using sub-THz frequencies.
Priority Software Announces the New, Game-Changing aiERP
06/12/2025 | Priority SoftwarePriority Software Ltd., a leading global provider of ERP and business management software announces its revolutionary aiERP, leveraging the power of AI to transform business operations.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.