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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Amphenol Releases 2022 Sustainability Report
April 18, 2023 | Amphenol CorporationEstimated reading time: Less than a minute
Amphenol Corporation released its 2022 Sustainability Report.
“Amphenol continues to strengthen our commitment to corporate sustainability across our organization, all while delivering exceptional performance for our shareholders,” said Amphenol President and Chief Executive Officer, R. Adam Norwitt.
“During 2022, we made excellent progress on our sustainability efforts. I am pleased to report that we have achieved all eight of the sustainability goals we set in our 2019 and 2021 reports, and in this report, we are setting eight new goals with target dates of either 2025 or 2030.”
“Our substantial progress towards making our company more sustainable for the long term is made possible only through the dedication and hard work of our truly outstanding employees around the world. Without them, we would not be able to protect our employees, reduce our environmental footprint and support our communities, all while delivering value to our customers, partners, employees, communities and shareholders.”
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11/06/2024 | SEMIThe European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.
Navigating the Supply Chain Challenges and Opportunities in Aerospace and Defense
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SEMI Energy Collaborative Releases Recommendations for Expanding Low Carbon Energy in Taiwan
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Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
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