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Comtech Secures Strategic Contracts for Hybrid Designed High-Speed SATCOM Solution
April 18, 2023 | Business WireEstimated reading time: 1 minute
Comtech announced that the company recently secured multiple orders for significant quantities of its CDM-780 high-speed software defined modems. These modems will be delivered to innovative, next generation satellite operators as well as to the U.S. Department of Defense who will be assessing, evaluating, and fielding these modems in a variety of scenarios to enable broad scale government and commercial deployments to provide end users with access to high-speed connectivity in some of the hardest to reach places in the world.
“Our CDM-780 is uniquely positioned to support the blending of communications services across multiple, diverse satellite orbits and networks,” said Ken Peterman, President and CEO, Comtech. “These contracts illustrate our continuing technology leadership and fluency in future networking capabilities that can help our customers democratize access to communications and empower individuals, communities, businesses, and governments across the globe.”
Comtech’s CDM-780 is one of the highest capacity commercial off the shelf gateway SATCOM solutions available today. Through a software-defined architecture, the CDM-780 is designed to readily adapt and evolve over time to deliver SATCOM services that can transition across high throughput and very high throughput satellite networks, as well as Low Earth Orbit, Medium Earth Orbit, and Geostationary Earth Orbit constellations.
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TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
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UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.