SHENMAO Offers UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV
April 18, 2023 | SHENMAO America, Inc.Estimated reading time: 1 minute

SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
The SHENMAO PF629-P214UV solder paste is a lead-free, no-clean formula that is ideal for use in a wide range of applications, from consumer electronics to automotive and aerospace components. Its unique UV-visible feature allows easy and accurate quality control inspection during production and ensures the product is used correctly and reliably.
Flux residue of PF629-P214UV after reflow process can be easily identified by UV light due to its special flux design.
The PF629-P214UV solder paste offers superior performance in terms of solderability, wettability, and printability, providing a strong bond between the components and the PCB. It has excellent wetting ability and can form strong, smooth, and shiny solder joints, making it an ideal choice for high-reliability applications.
SHENMAO Technology has a reputation for producing high-quality solder materials, and the PF629-P214UV solder paste is no exception. The company is committed to providing its customers with the latest and most advanced products and services, and the new solder paste is just one example of this commitment.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.