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Cicor’s Shareholders Approve All Proposals
April 19, 2023 | Cicor Technologies Ltd.Estimated reading time: Less than a minute

At yesterday's Annual General Meeting of Cicor Technologies Ltd. in Boudry NE, the shareholders approved all proposals.
The Annual General Meeting approved the 2022 annual report, annual financial statements, consolidated financial statements and appropriation of the available earnings. It also granted discharge to the members of the Board of Directors and Group Management for the 2022 financial year. In addition, the Board of Directors’ total remuneration for the next term of office and the remuneration elements for the Group Management for the following financial year were approved. The amendments to the Articles of Association proposed by the Board of Directors were approved by the Annual General Meeting.
Daniel Frutig, Chairman of the Board of Directors, as well as the existing Board Members Norma Corio, Denise Koopmans and Konstantin Ryzhkov were re-elected by the Annual General Meeting. Daniel Frutig and Konstantin Ryzhkov were also confirmed as members of the Nomination and Compensation Committee.
Further, the independent proxy, Etude Athemis, Rue Jaquet-Droz 32, 2300 La Chaux-de-Fonds and the auditors of KPMG AG, Zurich, were appointed by the Annual General Assembly for a further year.
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ICT Symposium Review: Sustainability and the Circular Economy
10/09/2025 | Pete Starkey, I-Connect007It was pleasant autumnal weather as we made our way once again to Meriden, the nominal centre of England, for the 2025 Annual Symposium of the Institute of Circuit Technology. Delegates were welcomed by technical director Emma Hudson who introduced and moderated a skilfully coordinated programme, focused on the highly relevant theme of sustainability.
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/03/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on. This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.
Understanding Signal Integrity, the Foundation of High-Speed Digital Design
09/25/2025 | Stephen V. Chavez, Siemens EDASignal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.
Siemens Launches Lighthouse Project of Made for Germany Initiative
09/23/2025 | SiemensIn the presence of political leaders and representatives of the business community, Siemens today laid the cornerstone for the new Siemens Technology Campus in Erlangen, Germany. A lighthouse project of the Made for Germany initiative, the Technology Campus will further strengthen the economic viability of Germany and the region primarily in the area of power electronics.