-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
BTU Releases the Next-Generation Reflow Oven Platform – Aurora
April 24, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the release of its newest reflow oven platform. Aurora is leading the way to the factory of the future by seeing reflow in a new light.
Aurora, the newest reflow oven platform, is designed based on years of expertise and leadership from BTU, the makers of the industry’s best performing reflow ovens. As the latest in a long line of world-class thermal systems, Aurora has quality and innovation in its DNA.
“It has always been the goal of BTU International to enable our customer’s success – and we’ve packed this new reflow oven platform with features that maximize thermal performance and productivity while decreasing maintenance and running costs,” said Rob DiMatteo, general manager of BTU International. “The Aurora was designed based on our many decades of experience in reflow with an eye to the future.”
Aurora systems feature a modern, fully updated user interface, integrated Aqua Scrub™ flux management technology, innovative Smart Power energy savings software, and advanced process control technologies. Aurora’s combination of superior thermal performance, process flexibility, and vision for the future sets the new standard for reflow ovens today – and for tomorrow.
This new reflow oven platform features the industry’s first factory configurable heating and cooling architecture providing the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling requirements, or increased throughput. In addition, the Aurora reflow platform features BTU’s exclusive closed-loop convection control technology that has been shown to maintain thermal performance even at significantly increased belt speeds, providing greater productivity, efficiency and throughput.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain
10/20/2025 | BTU International, Inc.BTU International, a leading global supplier of advanced thermal processing equipment for electronics assembly, today announced plans to expand its manufacturing operations into Singapore.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly
09/10/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region.
Pick and Place Machine Innovator - NECTEC Launches Next-Gen SMT Line Solution With LED and X-ray Technology
08/26/2025 | Globe NewswireNECTEC PTE. LTD., a leading provider of SMT electronics manufacturing equipment, announced the official launch of its next-generation SMT solutions, featuring newly upgraded pick and place machine, specialized LED pick and place machines, enhanced Reflow Oven technology, advanced X-ray Inspection, high-speed X-ray Counter, and premium Solder Paste