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Weller Introduces WXsmart Tweezers for the Wxsmart Soldering Platform
April 25, 2023 | WellerEstimated reading time: 1 minute
Weller Tools, a leader in hand soldering solutions and part of the Apex Tool Group, introduced its new WXsmart Tweezers for the WXsmart Soldering Platform. WXsmart Tweezers are designed to meet all state-of-the-art soldering and desoldering requirements, from miniaturization to heavy duty applications, as well as traceability and connectivity needs.
Precise and fast performance with built-in intelligence in tips and tool make the tweezers a reliable companion for all soldering tasks. Smooth workflows are facilitated by the optimized ergonomics of the tweezers. Additionally, the WXsmart Tweezers feature color lighting for fast tool identification. Handling also is improved with fast, toolless tip change with the highest precision for fast and continuous working processes.
PERFORMANCE – High Power, extremely fast heat-up and reaction times for increased productivity.
PRECISION – Perfectly adjusted tips save time by producing the best results.
SMART – The integrated chip controls the workflow and makes adjustments possible.
ERGONOMICS – The optimized handle ergonomics provide support for repetitive, identical work processes and make work easier.
WXMTS Micro Tweezers for WXsmart
The Intelligent/Smart De-Soldering Tweezer is the perfect solution for fast and precise SMD rework of chip components and small / medium SOP from PCB assemblies (supports usage under the microscope).
WXUTS Ultra Tweezers for WXsmart
The Smart De-Soldering Tweezer for Heavy Duty Applications is designed to solder and desolder SMDs such as QFP, PLCC and SOIC.
The WXsmart Tweezers feature improved ergonomics with the new soft grip design. The short-distance tip-to-grip and parallel sliding block ensure greater accuracy and comfort when working. The pre-adjusted pairwise tip design increases productivity as they are immediately ready to use.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.