Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Koh Young Technology is Exhibiting at the 2023 IEEE Electronic Components and Technology Conference
May 2, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to exhibit in booth 134 at the at the 2023 IEEE Electronic Components and Technology Conference from 30May to 02June 2023 in Orlando, Florida at the JW Marriott Orlando, Grande Lakes.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. IEEE Electronics Packaging Society is sponsoring the 73rd ECTC.
The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants with the opportunity to gain the insight and perspective of technical and business leaders.
“Whether an engineer, manager, student, or executive, ECTC offers something unique for everyone in the microelectronics packaging and components industry. I invite you to make your plans now to join us and to be a part of all the exciting technical and professional opportunities,” commented Mr. Florian Herrault, 73rd ECTC Program Chair. “I also want to thank our sponsors, exhibitors, authors, speakers, PDC instructors, session chairs, and program committee members, as well as all the volunteers who help make ECTC a success.”
The 2023 ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. Exhibit hours will be from 9:00am to 12:00pm and then again 1:30pm to 6:30pm on Wednesday, May 31, 2023. The second day of the expo is from 9:00am to 12:00pm and 1:30 to 4:00pm. Visit us in booth 134 to discuss your inspection or application challenge. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, the Senior Manager for Americas Marketing at Koh Young.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.