Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
Excellon Installs COBRA-II Hybrid Laser System at Accurate Circuit Engineering
May 15, 2023 | ExcellonEstimated reading time: 1 minute
Excellon has recently completed the installation of a COBRA-II Hybrid Laser System at Accurate Circuit Engineering, of Santa Ana, California.
James Hofer, General Manager at Accurate Circuit Engineering (ACE), comments:
“ACE provides cutting edge technology prototype PCBs and as such we need cutting edge technology. The Cobra-II brings a suite of laser drilling, milling and skiving advantages that no other unit we evaluated could compare with. Further, the support we get from Excellon is like no other. Though we evaluated multiple manufacturers of laser drilling systems it came as no surprise that Excellon performed better and allowed us the flexibility to do what we do best, high technology faster and better than the rest.”
Accurate Circuit Engineering (ACE) is a high technology, quick turn prototype PCB manufacturer specializing in RF, microwave, high-speed and antenna designs. In our Santa Ana based facility ACE can build a Multilayer PCB in as little as 24 hours. ACE is AS9100, ITAR Mil-PRF-31032 and D0D 2345 certified.
Mike Sparidaens, Vice President of Sales at Excellon, shared his comments:
“The COBRA-II Hybrid Laser System and can handle the most challenging rigid and flexible circuit board designs. The system is well known worldwide for its capability and reliability. We have enjoyed working with Accurate Circuit Engineering for many years and are very excited to have installed a laser system at their facility.”
Excellon, a U.S. based company, is recognized worldwide as a leader in installed PCB drilling systems with products ranging from single and multiple station mechanical drilling machines to hybrid laser precision via formation and routing systems. To meet increasing production volume, Excellon has opened a new manufacturing facility in Paramount, California, USA.
Share on:
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.