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AIM to Highlight H10 at the Expo Proveedor Industrial Matamoros 2023
May 15, 2023 | AIM SolderEstimated reading time: Less than a minute

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Expo Proveedor Industrial Matamoros 2023 taking place on May 23 and 24 at the Holiday Inn Hotel Convention Center in Matamoros, Tamaulipas, Mexico. AIM will highlight their newest halogen-free no clean solder paste, H10.
H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.
H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
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Federal Electronics Expands Selective Soldering Capabilities with Installation of Pillarhouse System
10/03/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo, Mexico facility, further strengthening its ability to support high-mix, high-complexity assemblies.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.
Circuit Technology Center Expands Robotic Tinning Capacity with Two Additional Hentec/RPS Odyssey 1325 Machines
10/03/2025 | Circuit Technology CenterCircuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce the addition of two new Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machines to its production floor.
SolderKing Marks Seven Years of Growth and International Recognition
10/01/2025 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating seven years of innovation, growth, and international success.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.