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Rehm Holds Specialist Seminar in Romania
May 17, 2023 | Rehm Thermal SystemsEstimated reading time: 2 minutes
For the second time, Rehm Thermal Systems, a specialist in the field of thermal system solutions for the electronics industry, invited participants to a series of lectures in Timisoara, Romania. In the border triangle of Romania, Hungary and Serbia, the experts from the Blaubeuren-based manufacturer gave presentations on Advanced Reflow Soldering and Conformal Coating to an interested audience from all over Eastern and Southern Europe. The response of the participants was clear: More of this!
What are the most important aspects of an optimal soldering profile? How can common and special defect mechanisms be avoided, how can sustainable PCB protection for electronic components be ensured? These and many other questions were answered by the experts from Rehm Thermal Systems and a guest speaker from Senju Metal Europe in numerous presentations during the two-day seminar. In addition, the guests had the opportunity to discuss their own experiences and problems as users at an open round table.
Advanced Reflow Soldering: Temperature Profiling & Troubleshooting
Dr. Paul Wild and Andreas Heltmann, Rehm Thermal Systems; Juraj Jánošík, Senju Metal Europe
Reflow soldering is still the most important bonding technology for electronic assemblies today. After intensive coverage of the basics of the technology during a previous seminar in Timisoara, this year's content was designed for an advanced audience - much to the delight of the professionally experienced participants. After a brief refresher on the basics of reflow soldering, the seminar therefore continued directly at a high level - from the various methods and rules of measuring board preparation to errors and tolerances of thermal imaging cameras and the factors influencing reflow profiling to the determination of temperature settings. The presentations by Rehm Thermal Systems were complemented by a contribution from the partner company Senju Metal Europe, which was dedicated to the chemistry of solder pastes and their behaviour during reflow soldering. The conclusion of the first day was reserved for troubleshooting - an offer that the invited guests gratefully accepted.
Advanced Conformal Coating
Gianfranco Sinistra, Rehm Thermal Systems
Coating technology in the electronics industry is constantly evolving. A wide range of materials and application methods are now being specially adapted to the assemblies to be produced - it is not easy to maintain an overview here. Day 2 of the seminar in Timisoara therefore focused on conformal coating. After a brush-up on the basics and diversity of coating technology, Rehm provided detailed information on failure analysis during the production process as well as on the coated products, cleaning under a wide range of environmental conditions and smart communication in the line. Finally, in a concluding discussion round, specific questions from the participants could be comprehensively discussed and answered.
More information, less marketing
Right from the start, the seminar in Timisoara, Romania, focused on information, qualification and training on advanced, high-level topics. The participants, most of whom were already specialists in their field, gained new insights into processes from their own day-to-day work and benefited not least in the discussion rounds from the experts' specialist knowledge. The fact that the experienced audience appreciated this concept is confirmed by the feedback: An overwhelming majority of participants not only found the seminar a great benefit, but also expressed a strong interest in further, regular events in Romania and Hungary.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
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Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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