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SigmaSense Announces Technology Licensing and Co-development with NXP Semiconductors
May 17, 2023 | Business WireEstimated reading time: 1 minute
SigmaSense announced a license and co-development with NXP Semiconductors to lead in the transition from traditional touch interfaces to multi-dimensional sensing capable of revolutionizing user experiences. SigmaSense has licensed technology to NXP, and the companies will collaborate on high-performance sensing products for specific applications with demands for faster, more robust, fully immersive software-defined experiences.
“The next generation of smart devices and applications are demanding data for enhanced functionality that requires an entirely new software-programmable approach to sensing,” said Lars Reger, CTO, NXP Semiconductors. “SigmaSense created a breakthrough in sensing technology with an innovative approach that makes exciting new product designs possible. We are thrilled to team with SigmaSense to productize a new era of NXP solutions.”
“NXP’s prowess in highly dependable products and deep expertise in high-volume semiconductor design combined with SigmaSense technology will accelerate game-changing sensing products,” said Rick Seger, CEO, SigmaSense. “Our co-development with NXP marks the transition to a universe of new data-centric design options driven by software-defined sensing.”
SigmaSense innovations make it possible to extract vastly more data from the physical world for a wide range of products and systems. Multi-dimensional sensing works through many different surfaces, shapes, and materials, enabling previously impossible designs. With the invention of measuring current direct-to-digital, SigmaSense delivers low-voltage, frequency domain sensing, an industry first. Fast, continuous, high-fidelity data capture with intelligent digital signal processing moves analog challenges to the digital domain, where design flexibility can deliver orders of magnitude improvement. SigmaSense is changing system designs from foldable displays to EV batteries.
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11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).