New Flex Circuits Guide Now Available From American Standard Circuits
May 22, 2023 | I-Connect007Estimated reading time: Less than a minute

I-Connect007 and American Standard Circuits are proud to announce the launch of the companion guide to the immensely popular The Printed Circuit Designer’s Guide to... Flex and Rigid-flex Fundamentals.
This short guide, written by topic experts at American Standard Circuits, is designed to provide additional insights and best practices for those who design or utilize flexible and/or rigid-flex circuit boards. Topics covered include trace routing options, guidelines for process optimization, dynamic flexing applications, rigid-to-flex transition and more. Visit I-007ebooks.com/flexcg to download and learn more.
I-Connect007 has published nearly three dozen educational books serving the printed circuit electronics supply chain. Visit the entire library here.
American Standard Circuits is a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the markets such as medical, automotive, industrial, defense, and aerospace in volumes from test and prototypes to large production orders. They have published multiple books, which can be found in the I-007ebooks library.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.