The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
ViTrox SMT Inspection Solution Receives IPC-CFX-2591 QPL Qualification
May 22, 2023 | ViTrox TechnologiesEstimated reading time: 2 minutes
ViTrox Technologies is excited to announce that our V310i Advanced 3D Solder Paste Inspection (SPI) Solution has officially passed the rigorous qualification audit for IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification.
This certification is a significant achievement for ViTrox and showcases the company's commitment to innovation and excellence in the electronics manufacturing industry. The V310i 3D SPI's listing on the IPC-CFX QPL shows that ViTrox's solution is fully compatible with the IPC-CFX-2591 standards, giving electronics manufacturers and Original Equipment Manufacturers (OEMs) the confidence to partner with us.
Our state-of-the-art V310i 3D SPI technology has unique features that set it apart from the competition. Our Artificial Intelligence (A.I.) Missing Detection significantly enhances users' experiences when detecting absent and insufficient solder with the integration of A.I. This feature is incredibly accurate and improves overall efficiency. Our effortless Inspection Parameter Setup allows users to export custom parameters fast for future usage, ensuring compliance with IPC standards. This feature streamlines inspection setups, making them more accessible and user-friendly. Lastly, our Ultra Smart Programming feature is a game-changer, reducing programming time by around 80%. The advanced programming algorithm in the ViTrox SPI Software (VAPIGUI) creates a fast, effortless, and easy-to-pick-up programming process for our users, making the V310i 3D SPI an excellent choice for anyone in the SMT PCBA industry.
Asides from the IPC-CFX standard, ViTrox's Industry 4.0 Manufacturing Intelligence Solution (V-ONE) provides Machine-2-Machine (M2M) connectivity and big data analytical capabilities for users to monitor production performance using real-time production process insights and data analysis with image traceability across ViTrox vision solutions. With V-ONE, manufacturers can have a strategic approach to oversee the production process, minimise production downtime, and improve production efficiency.
We are proud to continue developing innovative solutions with M2M connectivity to match the ever-changing demands of the electronics manufacturing industry, moving further into the era of Smart Manufacturing. Hence, ViTrox is actively collaborating with IPC to validate its PCB SMT Vision Inspection Solutions for the IPC CFX QPL. You can also find our validated solutions, the V510i Advanced 3D Optical Inspection (AOI) Solution and V810i Advanced 3D X-Ray Inspection (AXI) Solution, on the IPC-CFX-2591 QPL Portal at https://certification.connectedfactoryexchange.com/certification-directory.
Are you interested in implementing IPC-CFX compliant vision inspection solution to achieve Smart Factory? Contact us today at enquiry@vitrox.com for more information and assistance.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.