Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
May 23, 2023 | SEMIEstimated reading time: 1 minute
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced in their new Global Semiconductor Packaging Materials Outlook report.
High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth.
“The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials,” said Jan Vardaman, President and founder of TechSearch International. “Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates.”
The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.
Features of the report include:
- Technology trends
- Regional market size
- Five-year market forecast to 2027
- Market size in revenue and units
- Excel workbook file summarizing market information
- Supplier market share
- Capacity and utilization trends
Share on:
Suggested Items
DELO Thrives Amid Global Economic Uncertainty
05/09/2025 | DELOGermany/Sudbury, MA, May 9, 2025 | DELO, one of the world’s leading manufacturers of high-tech adhesives as well as dispensing and curing equipment, has announced that it has achieved over €245 million ($265 million) in revenue during the 2024/2025 fiscal year (ending March 31, 2025).
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
Creative Electron Strengthens Leadership Team with Strategic Appointments in Marketing and SMT Business Unit
05/08/2025 | Creative ElectronCreative Electron, the largest U.S. manufacturer of X-ray inspection systems for the electronics industry, is proud to announce the addition of two seasoned leaders to its executive team: Wagner Lima as Marketing Director and Giancarlo De La Garza as SMT Business Unit Director.
Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
05/08/2025 | BUSINESS WIREQuadric announced that Kyocera Document Solutions Inc. (hereinafter: Kyocera) has licensed the Chimera™ general purpose neural processor (GPNPU) intellectual property (IP) core for use in next generation office automation system on-chip (SoC) designs.