-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology
May 24, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.
“The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors,” said Dr. Klemens Brunner, Head of Heraeus Electronics.
The encapsulation material offers superior thermal conductivity (>5 W/m/K) and extreme temperature resistance (up to 300°C), enabling increased power densities and improved reliability. The license agreement also allows the extension of the application spectrum to encapsulation of passive components (magnetics, capacitors, or resistors), electric motors (stators), or other devices where a thermal bridge to a heat sink is required while ensuring protection against the environment.
“Collaborations like these show the importance of open innovation to speed up development cycles and it is a great example for the innovation power of Heraeus,” said Michael Jörger, Head of Business Line Power Electronic Materials at Heraeus Electronics.
“We are excited to share our knowledge and IP of this new technology with Heraeus to deliver inorganic potting compounds meeting the highest standards of performance and reliability. Like Bosch, Heraeus is committed to excellence and has a reputation of shaping the market with innovative products,” said Dr. Peter Wolfangel, EVP Corporate Sector Research and Advance Engineering at Bosch.
The agreement is significant given the increasing demand for power modules as key components of the transition towards electrification. With its existing material portfolio for packaging and interconnection of semiconducting power dies, Heraeus Electronics already offers cutting-edge solutions for power electronics such as sinter paste, DTS, and Ag-free AMB.
Suggested Items
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
09/19/2024 | I-Connect007Don't miss the final episode of "On the Line With… Designing for Reality," in which ASC Sunstone General Manager Matt Stevenson wraps up his deep dive into the PCB manufacturing process with a discussion of Routing, Final Fabrication, and Quality Control.
Tata, Analog Devices Announce Strategic Alliance to Explore Joint Opportunities for Semiconductor Ecosystem in India
09/19/2024 | Analog Devices, Inc.Tata Group, a global enterprise headquartered in India, and Analog Devices, Inc., a global semiconductor leader, announced a strategic alliance to explore potential cooperative manufacturing opportunities.
EDA Market to Grow $8.7 Billion (2024-2028) with AI's Rising Impact on Trends
09/19/2024 | PRNewswireThe market is estimated to grow at a CAGR of 10.26% during the forecast period. Growing significance of eda in electronic design process is driving market growth, with a trend towards machine learning disrupting global eda market
Altus Hosts Record-Breaking 'Factory of the Future' Event
09/17/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, in partnership with Fuji Corp., recently held its second ‘Factory of the Future’ event at the Advanced Manufacturing Technology Centre (AMTC) in Coventry.
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
09/17/2024 | Chris Mitchell -- Column: The Government CircuitSeptember in the United States is the season for back-to-school and football. In the arena of government policy advocacy, it’s the season for election campaigning and wrapping up the work of the current session of Congress. This month, there will be a flurry of efforts in Congress by legislators to complete action on “must-do” legislation, especially spending plans for FY25, which begins Oct. 1. In October, there will be a recess for the home stretch of the campaign; in November and December, there will be one more round of policy action by the “lame duck” office holders before the new U.S. government takes office in January. Now is the time for us to try and get those ducks in a row.