Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Expo and Tech Forum
May 24, 2023 | Conecsus Metals MéxicoEstimated reading time: Less than a minute

Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Expo and Tech Forum in Aguas Calientes on June 1, 2023 beginning at 11:00 AM, at the Aguascalientes Marriott Hotel, Boulevard a Zacatecas Norte, S/N Aguascalientes, Aguascalientes 20116 Mexico.
Conecsus Metals México will showcase a variety of metals waste recycling solutions. With solder waste reprocessing facilities located in Terrell, TX, USA, Conecsus LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as complex by-products that can be recovered from industries in North America and worldwide.
Conecsus representatives Yessica Romero, Regional Sales Manager, and Carolina Renteria, Customer Services Manager, illustrated how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, and Silver, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.