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iNEMI Packaging Tech Topic Series Webinar: LSI/PKG/PCB Co-Design

11/21/2023 | iNEMI
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.

Keysight EDA Strengthens Design and Simulation Support for Tower Semiconductor RF Process Technologies

11/16/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process.

Elementary, Mr. Watson: William of Ockham Meets Printed Circuit Boards

11/16/2023 | John Watson -- Column: Elementary, Mr. Watson
William of Ockham was a significant figure in medieval philosophy who lived from 1285 to 1347 and was an English Franciscan friar, philosopher, and theologian. William of Ockham is most famously known for formulating the principle of Occam's Razor, also known as the principle of parsimony. In simple terms, Occam's Razor is a problem-solving rule suggesting that when you have multiple possible explanations, the simplest one is usually the best. The most straightforward solution that fits all the facts without adding extra assumptions or complications.

The Pulse: Simplest Stackups Specified

11/15/2023 | Martyn Gaudion -- Column: The Pulse
Albert Einstein said, “Everything should be made as simple as possible, but not simpler.” Whilst his words were aimed at those describing complex theory in the simplest way possible, but not so simplified that key information is lost—a process which the media is often criticised for as “dumbing down” information. However, from an engineering perspective, if a design can be engineered to perform the required application in a simpler or more economic way than previously then simplification is truly a valuable goal.

Cadence, Autodesk Collaborate on Smart Product Design

11/14/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence® PCB solutions.
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