Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Yamaha Motor Launches New YRP10 Premium Printer
June 1, 2023 | Yamaha Robotics SMT SectionEstimated reading time: Less than a minute
Yamaha Robotics, SMT Section announced that the company will release the new solder paste printer YRP10 on August 1 of this year.
The YRP10 is a new premium printer that achieves high-speed, high-precision solder printing, fully automated setup changeovers, and also supports dual-lane production. The Company has achieved the highest level of printing accuracy in the industry with the adoption of the new-generation YR series platform with excellent rigidity, a 3S head with new squeegee, and stencil vacuum mechanism, and the optimization of printing conditions, etc. In addition, automation of setup changeovers, such as automatic push-up pins and stencil replacement, greatly reduces labor and human error when changing out products. Moreover, a dual-lane specification that enables completely independent operation for each lane can also be selected to flexibly support a wide variety of type of production.
Yamaha Motor has realized the ideal concept of a 1 STOP SMART SOLUTION by taking advantage of the company's strengths as a full-line up manufacturer of mounting equipment, including surface mounters, printers, dispensers, and inspection equipment. The Company promotes the Intelligent Factory system, which comprehensively realizes higher efficiency in the mounting process through smooth and advanced inter-equipment cooperation without black boxes.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.