-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Metcal Introduces CV-IOT Gateway Module and Desktop Application
June 5, 2023 | MetcalEstimated reading time: 1 minute

METCAL, a leader in benchtop soldering systems, announces the release of their new CV-IOT Gateway Module and desktop application which enables operations management to collect advanced soldering data from every benchtop station on their network.
By connecting the CV-IOT gateway to a Metcal Connection Validation (CV) soldering system and a computer or network, operations can utilize information on every joint to improve process control and efficiency in the soldering process. A standard handheld barcode scanner can easily be added to the setup for board-level traceability.
Using the desktop application, managers can easily analyze the data collected by the system to evaluate operator efficiency, quality of solder joints, temperature and power profiles, and even the cartridges used (including geometries, part numbers, serial numbers, and lot codes) for each soldering process. Alerts can also be set up to notify managers in real-time when processes are not being followed or when there is a concern with a soldering station.
The information from each solder event is stored using a standard database structure, ensuring the data is compatible with standard database applications and is easily accessible by the software application.
To ensure data security, the CV-IOT module plugs directly into the CV unit and the computer or network only through a wired connection.
The CV-IOT is expected to be particularly crucial for manufacturers where maximizing process control and traceability is essential.
“CV-IOT makes real-time process control and traceability simple,” said Seerena Wright, Metcal Product Manager. “CV-IOT allows users to quickly see what is happening throughout their operation, and to easily spot spikes or dips in throughput, identify potential problems, and trace the source of solder joint faults.”
CV-IOT is compatible with all Metcal Connection Validation™ soldering systems. The CV-IOT desktop application requires Windows 10, Intel® Core™ i5 CPU or better, 2 GB of RAM, Intel® HD Graphics, at least 150 GB of storage, and Ethernet 10/100.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.