Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Koh Young Returns to SEMICON West with New Inspection Solutions
June 13, 2023 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the industry leader in True3D measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.
The need for optical inspection in advanced package and semiconductor assembly arises from an increasing device complexity, high quality and reliability demands, process yield optimization, industry standard compliance, and cost reduction efforts. Wafer-Level Packaging (WLP), the technology of packaging a die while still on the wafer, is considered the next generation packaging technology, because it meets several of these criteria, yet many traditional inspection solutions fall short of delivering the capabilities required for success.
Building on our award-winning, industry-leading inspection technologies, the Koh Young Meister Series delivers True 3D measurement-based inspection for ultra-thin solder, wafer bumps, balls, and components. Manufacturers can maximize yield without increasing costs by detecting defects at the wafer level with accurate inspection.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & mini/micro-LED packaging process improvement.
- High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 mega-pixel camera with 3.5-micron resolution optics
- A picture containing text, kitchen appliance, home appliance, appliance
- 10-micron Thin Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Re?ective and Mirror-surfaced Components
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-re?ective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- True 3D Height and Tilt Measurement in High Density, Highly Reflective Applications
Meister W+ True 3D Measurement for Wafer Bumps & Shiny Components
Combining innovative vision algorithms and high-resolution optical technology, the Meister W+ inspects highly re?ective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading True 3D measurement capabilities enhanced by proprietary deep learning technology
- 10-micron diameter wafer bump inspection
- Revolutionary full 3D height and tilt measurement capability for even highly re?ective die surfaces
Neptune C+ Award-winning True3D Underfill and Coating Inspection with Thickness Measurement
Using UV light for presence or localized thickness inspection inherently limits accuracy, and applying a traditional laser approach is all too localized and simply takes too long in a production environment. Plus, these options only provide 2D results. The revolutionary Neptune C+ provides the ultimate solution to these and more challenges.
- L.I.F.T. (Laser Interferometry for Fluid Tomography) for non-destructive inspection
- True3D measurement-based Profiling of wet or cured materials
- Measures coatings, underfill, epoxy, bonding, glue, and more
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- "Smarter Manufacturing Enabled with Inspection Data" by Ivan Aduna, a free 12-part micro webinar series
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.