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June 13, 2023 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd., has announced plans to open a new manufacturing facility in Southeast Asia by 2025/26 to extend its manufacturing capabilities beyond China and Taiwan and enhance global supply chain resiliency.
Ventec’s wholly owned supply chain is unique among PCB materials suppliers and ensures unrivalled control over production quality and delivery performance to its global high-tech customer base. The new factory will duplicate manufacturing capability for Ventec’s full range of high-reliability and high-performance products and thus mitigate supply chain risks for PCB manufacturers, OEMs and EMSs across all regions by adding geographical diversity to the Company’s operations.
“Now is the right time to invest in establishing a local manufacturing presence to support the expanding southeast Asian electronics industry, which is experiencing significant growth across consumer, industrial, and automotive sectors,” said Jason Chung, CEO of Ventec. “Moreover, this new factory will enhance our global supply chain security promise to our global PCB and OEM customer base as we plan to manufacture the complete portfolio of advanced high-reliability and high-performance materials.”
Ventec’s range of laminates and prepregs include product lines optimized for superior signal integrity and high-speed digital applications, RF and analog circuits, thermally enhanced materials including insulated metal substrate (IMS) technology, and an advanced range of thermal management solutions. The company serves customers across the globe, active in industries including automotive, communication, aerospace, and defense.
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
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