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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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AT&S Wins the Airbus Avionics Supplier Award for 'Best Improvement Project'
June 16, 2023 | AT&SEstimated reading time: 2 minutes
AT&S’s long-standing customer, Airbus Avionics, chose AT&S’s copper recycling project “AERIS” as best improvement project at the 1st Airbus Avionics Supplier Day in Toulouse. AT&S process engineer, Florian Trinkl, was on stage to receive the prize stating: “This award from an important partner shows that our commitment to sustainability is valued. It was nice to receive this recognition in the name of the entire AERIS team.”
More copper, less pollution
With the implementation of an innovative and homegrown wastewater treatment process, AT&S demonstrates a new solution for sustainable resource management and recycling practices in the electronics industry: AERIS is a copper recycling system developed by AT&S to recover pure copper and chemicals from waste. The benefits are obvious: smaller demand for chemicals and copper, less waste, less CO? emission and more efficient reuse of resources.
The AERIS project was launched back in 2019 and was recently installed at AT&S’s headquarters in Leoben Hinterberg, Austria. Its infrastructure will soon enable the recovery of up to 1000 kg of pure copper per day, as well as the reuse of a significant amount of chemicals extracted from wastewater.
This comprehensive circular production makes it possible for AT&S to drastically reduce the acquisition of copper, hydrochloric acid and chemicals for wastewater treatment, whilst limiting and preventing the build-up of several tons of industrial sludge per year. AERIS reduces AT&S’s carbon footprint by 29% compared to a standard primary use of copper by minimizing the need for the expensive production and transport of valuable resources.
Through this unique and sustainable innovation, AT&S was able to register eight new patents in relation to AERIS, six of which have already been granted.
Sustainability strategy
“The implementation of AERIS is an important milestone for our sustainability strategy. We demonstrate that we are not only a technology leader in electronics but also in sustainable manufacturing. Our innovative products help to shape the future of energy, traffic and communication systems”, says AT&S CTO Peter Griehsnig.
Once the fine-tuning of the AERIS system in Hinterberg is completed, AT&S will start evaluating the roll out of similar systems for its other production plants around the world. AERIS is an important part of a broader sustainability strategy, through which AT&S has committed itself to several concrete goals that will reduce the company’s carbon footprint and deliver a path to sustainable growth.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.