Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Semiconductor Leaders Mark 30th Anniversary of Global Industry Cooperation in Geneva

06/16/2026 | ESIA
On June 11, 2026, the world's leading semiconductor industry associations concluded the 30th anniversary meeting of the World Semiconductor Council (WSC), held June 8-12 in Geneva, Switzerland, and hosted by the European Semiconductor Industry Association (ESIA).

SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next

06/16/2026 | SEMI
SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week.

I-Connect007 Magazine Examines the Balance Between Innovation and Proven Practice

06/16/2026 | I-Connect007 Editorial Team
The debate between old school and new school thinking has existed throughout every era of technological advancement. In the June 2026 issue of I-Connect007 Magazine, we examine how that debate is playing out across today's PCB design, fabrication, and manufacturing landscape.

Technica USA and Supply Partners Participate in SMTA San Diego Expo and Tech Forum

06/15/2026 | Technica USA
Technica USA, along with its valued partners, Inovaxe and Creative Electron, participated in the SMTA San Diego Expo & Tech Forum last week at the El Corazon Event Center.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in