-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Averatek Names New CEO
June 21, 2023 | AveratekEstimated reading time: 1 minute

Averatek is pleased to announce Scott Meikle, Ph.D. as CEO. Dr. Meikle has more than 30 years of experience in the semiconductor industry. For the past six years he served as SVP - Global Customer Operations at Lam Research. Lam is a leading manufacturer of semiconductor manufacturing equipment and semiconductor packaging products with over $17 Billion in revenue and 14,000 employees. Prior to Lam, Dr. Meikle was resident in Taiwan for 5 years serving as the President of Inotera Memories, a publicly listed company. Dr. Meikle also worked for Micron, another semiconductor giant, for over 20 years in R&D, manufacturing, and executive positions.
There are exciting opportunities for Averatek: its flagship product is Liquid Metal Ink™, key chemistry for the Averatek Semi-Additive Process (A-SAP™). This groundbreaking technology enables fine pitch metallization on a variety of traditional and novel substrate materials and has applications across a broad range of market sectors: medical, high-speed digital and ultra-high density interconnects for military, aerospace and commercial products. With unique capabilities that enable dramatic improvements in functionality and reliability, Averatek offerings have drawn the interest of major industry players, and are featured in contracts with the Department of Defense and other government agencies.
With expansion planned into the semiconductor market sector, Dr. Meikle will build out the Averatek leadership team. His experience and extensive network across the electronics industry, from the United States and Europe to Asia, will be tremendously valuable in setting strategy and developing customer and partner relationships.
Outgoing CEO Haris Basit remains active as a Senior Advisor to the company.
Basit commented: “I am proud of our accomplishments during my six years, notably our progress in the PCB sector. I look forward to continuing my support of Averatek, its customers and partners. The Board and I are very enthusiastic about working with Dr. Meikle to bring Averatek to the next level."
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
09/17/2025 | GlobalFoundriesGlobalFoundries announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.