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CACI Awarded IDIQ Contract with $1.2 Billion Ceiling to Deliver Mission Critical Capabilities to the U.S. NAVWAR
June 22, 2023 | Business WireEstimated reading time: 1 minute

CACI International Inc. announced that it was awarded a seven-year single-award indefinite delivery indefinite quantity (IDIQ) mission technology contract, called Spectral, with a $1.2 billion ceiling for the U.S. Navy’s Naval Information Warfare Systems Command (NAVWAR).
“We are proud the U.S. Navy selected CACI to develop and deploy the next-generation of shipboard signals intelligence and electronic warfare capabilities,” said John Mengucci, CACI President and Chief Executive Officer. “Our strategy to invest ahead of customer need sets us apart from our competition and allows us to provide the most advanced technology, enabled by software, at the speed of ever-accelerating threats. We are honored to support the Navy to ensure dominance in all environments and against all adversaries.”
The Navy’s Spectral mission is to provide rapid capability enhancements for tactical mission operations. On the Spectral contract, CACI and its teammates will utilize its industry-leading software development and electromagnetic spectrum capabilities to develop and deploy the Navy’s next-generation shipboard signals intelligence (SIGINT), electronic warfare (EW), and information operations (IO) weapon systems. CACI’s open-architecture approach will provide the Navy with cutting edge tools and capabilities enabled by continuous software enhancement to support the Navy’s desire for rapid, informed, and accurate decision-making.
Todd Probert, President of National Security and Innovative Solutions at CACI, said, “We will use our decades of innovative software experience, world-class Agile software development, and DevSecOps to converge SIGINT, Cyber and EW into scalable, networked, and distributed warfighting capabilities that outpace evolving threats.”
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Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
indie Semiconductor to Acquire Automotive Perception Software Leader emotion3D
08/11/2025 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, announced it has signed a definitive agreement to acquire emotion3D GmbH, a Vienna, Austria-based specialist developer of advanced perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS) and automated driving.
FuriosaAI Closes $125M Investment Round to Scale Production of Next-Gen AI Inference Chip
07/31/2025 | BUSINESS WIREFuriosaAI, a semiconductor company building a new foundation for AI compute, today announced it has completed a $125 million Series C bridge funding round. The investment continues a period of significant momentum for Furiosa as global demand for high-performance, efficient AI infrastructure soars.
Siemens, PTC, and Dassault Systèmes Named Leaders in ABI Research's PLM Assessment for Large Discrete Manufacturers
07/28/2025 | PRNewswireThe Product Lifecycle Management (PLM) market has witnessed significant developments over the past year with the rise of Software-as-a-Service (SaaS), digital twins, and Generative AI (Gen AI) becoming integral for large discrete manufacturers.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.