-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA
June 23, 2023 | YINCAEEstimated reading time: Less than a minute
YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.
UF 120HA offers several key benefits:
- Fully compatible with all no-clean solder paste flux residue
- Eliminating the cleaning process and its pollution
- Lower temperature snap cure (<120 ºC)
- Passes 5×260 ºC without any deformation of the solder joint
- Better than all competitors' underfill with a cleaning process
- Lower CTE and able to flow into small gaps
- Reworkable
- Large cost savings
"Our team is excited to introduce UF 120HA to the market," said YINCAE's Chief Technology Officer. "We understand the challenges facing manufacturers today, and we have designed this product to address those challenges head-on. UF 120HA offers fast flow, low-temperature cure, compatibility with all no- clean flux residue, and reworkability, making it an ideal solution for a wide range of high-throughput manufacturing applications."
YINCAE’s UF 120HA is available immediately for purchase.
Suggested Items
SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.
Connect the Dots: Designing for Reality—Surface Finish
01/29/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
AIM Solder Promotes Kelly Cardone to Vice President, Customer Experience
01/21/2025 | AIMAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the promotion of Kelly Cardone to Vice President, Customer Experience. This promotion highlights AIM’s commitment to offering superior support and customer experience.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
01/21/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
01/17/2025 | PetersPeters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).