Littelfuse to Acquire 200mm Wafer Fab Located in Dortmund, Germany
June 28, 2023 | Business WireEstimated reading time: 1 minute

Littelfuse, Inc., a diversified, industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced it has entered into a definitive purchase agreement to acquire a 200mm wafer fab located in Dortmund, Germany (Dortmund fab) from Elmos Semiconductor SE. Key transaction benefits include:
- Expands business opportunities in high-growth industrial end markets like renewables, energy storage, automation, motor drives, power supplies, and e-Mobility off-board charging infrastructure
- Provides a highly skilled technology team with extensive 200mm manufacturing and development experience
- Defined multi-year capacity sharing arrangement with Elmos Semiconductor SE to allow Littelfuse to ramp its technologies over time; initial term lasting through 2029
“The acquisition of the 200mm Dortmund wafer fab is an important element in our long-term growth strategy for power semiconductors,” said Chad Marak, Senior Vice President and General Manager, Littelfuse Semiconductor Business. “Key to our sustained success is expanding our portfolio of technologies and growing internal capabilities to enable us to meet the increasing demands of our customers in high-growth power conversion applications. The Dortmund fab complements our current footprint, adding a highly experienced team and an efficient high-quality wafer processing operation. We are excited about the future prospects of our combined teams and capabilities, which I am confident will continue to position us for long-term profitable growth.”
The acquisition of the Dortmund fab is expected to close early in fiscal year 2025. The total purchase price for the fab is approximately 93 million Euro, of which approximately 37 million Euro will be paid after regulatory approvals, and approximately 56 million Euro will be paid at closing. The transaction is not expected to have a material impact on the company’s fiscal year 2023 or 2024 financial results.
Suggested Items
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
The Big Picture: Our Big ‘Why’ in the Age of AI
06/25/2025 | Mehul Davé -- Column: The Big PictureWith advanced technology, Tesla, Google, Microsoft, and OpenAI can quickly transform life as we know it. Several notable artificial intelligence (AI) studies, including the 2024 McKinsey Global Survey on AI, have offered insights into AI’s adoption, impact, and trajectory. The McKinsey study revealed that AI adoption continues to grow, with 50% of respondents reporting using AI in at least one business area.
Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference
06/16/2025 | Pete Starkey, I-Connect007It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.