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The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 30, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

It’s a heady time here in the U.S. between the summer holidays of Memorial Day (last Monday in May) and Independence Day (July 4). This four-week period straddles the Northern solstice, boasts the longest days of the year in the Northern Hemisphere. This is the high season for outside activities, which may be pulling you away from the office. Am I right? Never fear, I-Connect007 is here to deliver the “must know” news stories.
I’m bending the rules (again) this week by adding some additional links to some of the news items, so as to provide a more comprehensive picture of the story. So, what do we have? A conversation with Omron, news from Isola and Insulectro, Pete Starkey’s EIPC Summer Conference coverage (keynote, Day 1 and Day 2 summaries), and IPC monthly sales reports for EMS and PCB fab.
If you’re in the U.S., have a wildly independent holiday weekend; for our global readers, we’ll still be here, watching the news for you. Stay tuned.
Omron Discusses SPI, AI and More
Published June 26
At the recent SMTA Oregon Tech Forum and Expo, Tim Anderson, a senior account manager at Omron, presented his insights on SPI, the latest trends in the industry, and some solutions to consider. Afterward, Barry Matties caught up with Anderson for a follow up discussion. As Anderson points out, the SPI, AOI, and AXI systems of today do far more than simply catch defects. This is a short and informative read for anyone following these machinery applications.
Isola Changing With the Times
Published June 29
Changing market conditions require changes in approach. I-Connect007’s Barry Matties and Nolan Johnson spoke with Isola’s Travis Kelly, Sean Mirshafiei, and Kirk Thompson about Isola’s recent responses to market conditions. In this interview, Kelly, Mirshafiei, and Thompson outline recent changes to Isola senior leadership, optimizing manufacturing to meet the needs of the global market, and the strategic importance of advanced packaging to the global economy, and to the U.S., in particular.
EIPC Summer Conference 2023: The Keynote Session
Published June 26
The EIPC technical sessions–whether the monthly snapshot sessions, or the semi-annual conferences– are eternally full of high-value technical updates. This year’s summer session follows that same tradition. Of course, Pete Starkey’s detailed narratives always bring an extra bit of humanity to the sessions. We’re leading with Mr. Starkey’s coverage of the keynote, but I’ve added links to the summaries for Day 1 and Day 2 here, as well.
Insulectro Announces New Partnership With Laminate Suppliers Arlon Electronics Materials and EMC
Published June 27
Insulectro announces its new status as exclusive distributor for North America of Arlon copper clad laminates beginning Sept. 4, 2023. In addition, Arlon is the master distributor for Elite Materials Company (EMC), based in Taiwan. This brings both product lines to the Insulectro line card. Read here to get the details.
North American EMS Industry Up 7.1% in May
Published June 22
Read the whole post here, but just to tease the content, “EMS bookings in May increased 0.8 percent year-over-year and increased 4.4 percent from the previous month.” Also linked to the EMS report is the PCB fabrication report: North American PCB Industry Sales Up 6.7% in May
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.