-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SEHO, Lean Stream Start Strategic Partnership
July 10, 2023 | SEHO North America, Inc.Estimated reading time: 1 minute
SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, is proud to announce a new partnership with Lean Stream for technical sales representation across the northern regions of California and Nevada.
Established in 2003, Lean Stream is a value-added manufacturer’s representative and distributor based in Silicon Valley that provides world-class leadership in electronics assembly solutions to enable a Smart Factory.
“Our companies complement each other perfectly. In this way, the partnership creates synergies that guarantee successful support for our customers,” emphasizes Gus Mavrou, Regional Sales Manager at SEHO North America and he adds “Lean Stream has superior understanding of both manufacturing processes and our customers’ requirements. With this new partnership, we are optimally adapting sales in Northern California and Northern Nevada to customer needs with increased flexibility and great agility.”
SEHO implements total solutions that are efficient and powerful. The modern soldering systems are ideally supplemented by innovative THT-AOI systems as well as automation technology.
Robert Jones, Lean Stream President states “in talking with industry leaders and customers that I respect, the feedback is that SEHO provides the most innovative designed selective and wave solder machines in the industry for decades. With the design of low maintenance, smaller solder pots, and solder transfer design, it is very effective for our customers with complex requirements.”
The common goal of both companies is the efficient support of the customers in the implementation of their production goals in order to make them even more successful.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.