Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment
July 10, 2023 | SiemensEstimated reading time: 3 minutes
Siemens Digital Industries Software introduced Solido™ Design Environment software – an artificial intelligence (AI)-powered, cloud-ready integrated circuit (IC) design and verification solution that can help design teams meet and exceed increasingly aggressive power, performance, yield and reliability requirements while helping to dramatically speed time to market.
IC engineering teams must increasingly adapt to a new era of substantially higher design complexity driven by demand for compelling, highly differentiated applications across industries including wireless, automotive, high-performance computing (HPC), and internet-of-things (IoT). Siemens’ new Solido Design Environment software has been developed to help circuit designers address this challenge, delivering a unified approach for custom IC design and verification that can help designers to achieve high overall design quality and reduce time-to-market, while optimizing for these inter-dependent tradeoffs.
The newest addition to Siemens’ intelligent custom IC verification platform, the Solido Design Environment software, features AI technology and cloud deployment readiness. The Solido Design Environment software provides a single, comprehensive cockpit that handles nominal and variation-aware analysis, including SPICE-level circuit simulation setup, measurements and regressions, as well as waveforms and statistical results analysis.
Using AI technology, the solution can help users identify optimization paths to improve circuit power, performance, and area, as well as to perform production-accurate statistical yield analysis at a fraction of runtime compared to brute-force methods. It also features new Additive Learning technology that assists in significantly boosting performance for design and verification teams, producing smarter and faster AI decisions and analysis using retained AI models. With these advanced capabilities, the Solido Design Environment software can help to achieve verification accuracy up to 6 sigma and higher yield at speeds orders of magnitude faster than brute-force Monte Carlo, while helping to significantly improve coverage and accuracy.
“Semiconductor content is growing dramatically in a multitude of applications,” said Amit Gupta, vice president and general manager of the Custom IC Verification division at Siemens Digital Industries Software. "Engineering teams must adapt to higher design complexity and increasing variation effects, while meeting power, performance, area, and yield targets. With cutting-edge AI technology for signoff variation analysis seamlessly integrated into an intelligent, cloud-ready design environment, Solido Design Environment software represents a breakthrough for custom IC design, providing disruptive advantages for standard cell, memory, and analog IP design teams.”
Early customers are experiencing significant benefits. Using the new solution, SK hynix Inc., a top tier global provider of advanced memory and sensor technologies, significantly reduced the time it takes for them to go from initial design to production. “Verification accuracy and turnaround time are key factors in our design flow, as we create the next generation of memory technology,” said Mr. Do Chang-Ho, head of Computer Aided Engineering at SK hynix. “Siemens’ Solido Design Environment software has delivered brute force-accurate variation analysis coupled with powerful and easy-to-use design optimization, which has significantly reduced the time it takes for us to go from initial design to production.”
Other industry leaders on Solido Design Environment
“The Solido Design Environment software is a clear example of how Siemens EDA listens to their users and develops solutions that empower users to achieve better results,” said Sam Bagwell, director of US Design Services for Forza Silicon (AMETEK, Inc.). “Our designers use Solido Design Environment software as their simulation environment when custom designing state-of-the-art, low-noise, high-resolution, ultra-high speed CMOS image sensors for a wide range of applications including cinematography, machine vision, automotive, AR/VR, and more. We have had an outstanding experience with the solution, due to its productivity-boosting design workflows, intuitive results visualization, and excellent user support.”
“We have been using the Solido Design Environment software in our production custom design methodology, and it has exceeded our expectations,” said Patrick Camilleri, co-founder and vice president of Engineering at Crypto Quantique. “Thanks to the solution’s flexibility to adapt to our use models, we were able to integrate it into our existing methodology with ease and take advantage of its tool-assisted workflow capabilities to boost our design efficiency.”
“Solido Design Environment’s variation-aware verification capabilities have significantly benefited our design flow," said Randy Caplan, chief executive officer for Silicon Creations. "Its ability to quickly and accurately identify potential issues at high sigma, as well as to provide insights on optimizing our designs to work at a high degree of robustness, have been helpful to designers as we continue to provide world-class design IP to our customers.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.