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Suggested Items

3 Key Takeaways: Design for Test Starts Long Before the First Test

08/05/2026 | I-Connect007 Editorial Team
Design for test has traditionally been viewed as the last checkpoint before a product enters production. Bert Horner's The Printed Circuit Assembler's Guide to... Design for Test challenges that thinking. In his book, he argues that testability should influence every stage of PCB and CCA development, from the first schematic through layout, manufacturing, inspection, and long-term product support. The result is a practical guide that connects engineering decisions with measurable manufacturing outcomes.

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

ESD Alliance Names Two Executives to Governing Council, Adds Companies to Member Roster

08/04/2026 | SEMI
The Electronic System Design Alliance (ESDA), a SEMI Technology Coalition, appointed Ankur Gupta, Executive Vice President, IC Portfolio, Siemens EDA, Siemens Digital Industries Software, and Dr. Walden “Wally” C. Rhines, CEO and Director of Silvaco, to its 10-member Governing Council. ESDA also welcomed two new member companies, startups ChipAgents and Rydev.

SMTA Bright Manufacturing Challenge Enters Its Second Year With 30 Teams

08/04/2026 | Marcy LaRont, I-Connect007
SMTA’s second annual Bright Manufacturing Challenge kicked off July 1 and will end at SMTAI in October as college students from 30 teams (nearly double from the first year) compete to build a robot from the design to fabrication to assembly. Finalists will watch as the robots they built race for the first-place award. SMTA’s Tara Dunn talks about the program and this year’s challenge, what they’ve learned, and how excited the students are to be involved.

Powering the Future: Performance Is Won in Assembly

08/05/2026 | Brian Buyea -- Column: Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper— to the how it performs in assembly. No matter how good your substrate is, if the assembly isn’t right, none of it matters. Engineers are coming to terms with the fact that performance is more than the circuit. It’s now about the system, and that’s where assembly stops being an afterthought and becomes the whole game.
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