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The Chemical Connection: Back to Basic Cupric Chloride Etching

07/08/2026 | Don Ball -- Column: The Chemical Connection
We have received several calls in the past few months from younger process people who have been thrust into more senior process positions as their older colleagues retire. They’ve realized they lack the practical knowledge their predecessors have accumulated over the years. They know what their various process parameters are, but not why those particular parameters were in place. I found that the most frequently asked questions have been about cupric chloride etch chemistries. Therefore, I will cover the very basics of cupric chloride etching; not so much the technical facts but why we give the advice we do.

Matric Group First US Manufacturer to Deploy Panasonic NPM-GH SMT Tech

06/30/2026 | EINPresswire.com
Matric Group has made a major investment in advanced dual-lane surface-mount technology (SMT) manufacturing at its Seneca, Pennsylvania headquarters, expanding domestic capacity for high-reliability, high-mix electronics production.

Target Condition: Signal Integrity Without Borders

06/24/2026 | Kelly Dack -- Column: Target Condition
I started my PCB design career in 1980, long before “signal integrity” became a formal discipline. Back then, we were trying to “connect the dots” on simple, two-sided PCB layouts using the new $80,000 interactive graphics terminals we called a CAD system. By the time PCB design conferences emerged in the 1990s, signal integrity had begun to formalize into a discipline of its own. Much of the early, visible thought leadership came from North America and parts of Europe.

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.
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