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PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times

11/20/2024 | PRNewswire
PI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.

SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar

11/12/2024 | SMTA
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.

2024 Stromberg Student Leader Scholarship Recipient Announced

11/05/2024 | SMTA
SMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.

Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®

11/04/2024 | Indium Corporation
Indium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
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