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ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

12/02/2024 | ZESTRON
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield” 

QinetiQ US Awarded $42M Task Order to Support U.S. Army Advanced Sensor Processing and Imaging Technologies

12/02/2024 | QinetiQ
QinetiQ US has been awarded a four-year, $42 million task order to support the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center's Research & Technology Integration (RTI) Directorate.

Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes

11/27/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido™ SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. 

At Schneider Electric, Future of MES/MOM Lies in the Cloud

11/26/2024 | Schneider Electric
Schneider Electric’s mission is to be the trusted partner for sustainability and efficiency. The company is helping customers across industries unlock efficiency, productivity, and resilience through digital transformation. Schneider Electric is also accelerating its own digital transformation across production facilities.

HPC Customer Engages Sondrel for High End Chip Design

11/25/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
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