The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Ansys Enables Flexium's 5G mmWave Antenna Module Designs to Advance ADAS/AV Technology
July 13, 2023 | PRNewswireEstimated reading time: 1 minute
Flexium uses Ansys simulation solutions to explore design ideas, and develop and test antenna modules for high-frequency signal transceiver designs used in advanced driver assistance systems (ADAS) and autonomous vehicle (AV) applications. With support from Ansys tools, the printed circuit board (PCB) manufacturer's R&D team can also test the durability and reliability of its PCB boards, as well as explore new design ideas through layout and material experimentation at a relatively low cost.
Within Flexium's PCB layouts are numerous flexible print circuits (FPCs) responsible for critical connections that enable 5G communication in ADAS and AV applications. Any design deficiencies within these layouts can negatively impact FPC transmission characteristics responsible for vehicle perception.
To address these challenges, Flexium uses Ansys simulation software for the electromagnetic, thermal, and mechanical optimization of its FPC designs through efficient layout and material changes. Ansys tools also helped Flexium set specific parameters for board layout and materials, then create a reference library for future mmWave design verification.
"Ansys delivers the greatest predictive accuracy and yields the strongest results for us during PCB layout analysis critical to today's ADAS and AV applications," said Ming-Chi Cheng, president of Flexium. "Looking beyond 5G, we will continue to reference Ansys simulation to discover new methods for optical integration and communication that will help shape the future of our mmWave antenna module designs."
"With Ansys, global PCB industry leaders like Flexium realize the freedom to explore possibilities in board application design, and successfully develop forward-thinking antenna solutions for high-frequency signal transceiver applications," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "As the momentum behind miniaturization continues to build, our simulation solvers will accelerate the satellite, driverless, and related wireless signal modules powering this trend."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.