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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Summer Issue of IPC Community Now Available
July 17, 2023 | Michelle Te, I-Connect007Estimated reading time: 1 minute
IPC launches its summer issue of Community today. Packed with over 100 pages of member success stories, market impact content, and global membership updates this issue will keep you up to date with the latest industry conversation.
“With each issue, we harness the power of networking while demonstrating the unique partnership between IPC and its members, who are all doing important work within microelectronics,” says Michelle Te, IPC Community managing editor. “That might look like coverage of the premier SummerCom Golden Gnome Awards, an interview with a son who followed in the footsteps of his father on standards development committees, or highlighting a training program for young operators in India. These stories feel so relevant and timely.”
IPC Community puts the spotlight on the IPC Education Foundation in this issue. You’ll hear from Joe O’Neil, chair of the education foundation, get details about the new Careers in Electronics website, and meet the team of professionals behind it all.
This issue also includes class schedules for instructor-led courses, updates on the latest standards, a message from IPC President and CEO Dr. John W. Mitchell, a debrief about the banking crisis from IPC’s lead economist Shawn DuBravac, and a breakdown of the A-Teams behind the growing field of e-textiles.
Join your friends on the journey through IPC Community. Look inside this issue here. To download the PDF, click here.
To subscribe to Community, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.