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Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

UHDI Fundamentals: UHDI Technology and Industry 4.0

08/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

Nolan’s Notes: The Interconnectedness of a Global Supply Chain

08/04/2025 | Nolan Johnson -- Column: Nolan's Notes
You may recall when I’ve discussed the research and development of a particular magazine issue topic and how, at times, I’ve pivoted at the last minute because of what I learned from the information I’ve gathered. This month, my original focus was on cultivating your brand, but the more I investigated the topic, the more my subject experts leaned toward international supply chain strategies. Not surprisingly, these two disparate topics are far more interrelated than they might seem.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/01/2025 | Nolan Johnson, I-Connect007
We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.

Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services

07/31/2025 | Global Electronics Association
The Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).     

Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity

07/31/2025 | PRNewswire
Teramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
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