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SEMI Announces SEMICON West 2024 Dates
July 19, 2023 | SEMIEstimated reading time: Less than a minute

SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced that SEMICON West 2024 at the Moscone Center in San Francisco will be held July 9-11.
SEMICON West is moving to Phoenix for a five-year annual rotation and shifting from its longstanding July event dates to October beginning in 2025. The exhibition and conference will be held again in Arizona in 2027 and 2029, with all three appearances at the Phoenix Convention Center.
Phoenix will first host SEMICON West Oct. 7-9, 2025. The event will continue to be held at the Moscone Center in San Francisco on the alternating years and over the long term.
“We look forward to bringing the remarkable excitement pervasive at SEMICON West 2023 to next year’s exhibition and conference,” said Joe Stockunas, President of SEMI Americas. “Semiconductor industry growth, sustainability and talent will remain major themes at SEMICON West 2024 as we again provide a stage for critical insights and conversations key for the industry to flourish in the years to come.”
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: The Interconnectedness of a Global Supply Chain
08/04/2025 | Nolan Johnson -- Column: Nolan's NotesYou may recall when I’ve discussed the research and development of a particular magazine issue topic and how, at times, I’ve pivoted at the last minute because of what I learned from the information I’ve gathered. This month, my original focus was on cultivating your brand, but the more I investigated the topic, the more my subject experts leaned toward international supply chain strategies. Not surprisingly, these two disparate topics are far more interrelated than they might seem.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/01/2025 | Nolan Johnson, I-Connect007We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.