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New Podcast Episode: How Does UHDI Benefit SWaP?
October 3, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 has just released the latest episode in its groundbreaking podcast series on one of the most important innovations shaping the future of electronics manufacturing: ultra high density interconnect (UHDI).
In Episode 4, SWaP Considerations, host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
“John paints a clear picture for listeners of how the industry can leverage these innovations to push the boundaries of performance and design,” says host Nolan Johnson of the 12-part series.
Across the series, listeners step inside the evolving world of UHDI with insider perspectives, practical examples, and clear takeaways that show how this technology is reshaping electronics. Each episode is paired with downloadable resources that make applying the lessons directly to professional development and day-to-day challenges easy.
I-Connect007's On the Line with...American Standard Circuits: UHDI podcast series is available now on the I-Connect007 platform and all major podcast directories.
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Rachael Temple - AlltematedSuggested Items
Signal Integrity Meets Additive Innovation in the Latest Issue
05/18/2026 | I-Connect007 Editorial TeamSignal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.