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Designing for Cost to Manufacture

11/21/2024 | Marcy LaRont, I-Connect007
ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.

OSI Systems Receives $11M Order for Electronic Assemblies

11/21/2024 | BUSINESS WIRE
OSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.

CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging

11/21/2024 | U.S. Chamber of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.

NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability

11/21/2024 | JCN Newswire
NTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.

Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology

11/21/2024 | Hon Hai Technology Group
Hon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).
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