American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
KSG Group Puts Horizontal OSP Line for Organic Surfaces into Operation
July 31, 2023 | KSG GroupEstimated reading time: 1 minute
The KSG Group has expanded its capacities in the field of organic surface coating by bringing a new wet-chemical horizontal system online. The OSP line from TSK Schill enables the printed circuit board (PCB) manufacturer to implement a higher production volume and also features optimised processing operations, improved occupational safety and health, and a high degree of user-friendliness.
As an alternative to metallic surface finishes, OSP (organic solderability preservative/organic surface protection) is a favourable and RoHS-compliant variant that produces a flat soldering surface and can be renewed several times without damaging the PCB. The nickel-free coating is also suitable for high-frequency applications and can be combined with electroplated nickel/gold (NiAu) if necessary. The KSG Group can now take full advantage of these and further benefits to obtain not only a higher capacity, but also high-quality results with a uniform layer thickness and a very homogeneous surface: the new OSP line is characterised by improved rinsing and drying technology as well as a constant etching rate of the pretreatment through a feed-and-bleed dosing of the pickle.
Occupational safety and health have also been increased as part of the new acquisition: since the plant has automatic dosing of the chemistry as well as automatic pH monitoring and adjustment by the controller, the plant operator does not need to perform as much manual handling of the chemicals. Intuitive and clearly structured system software as well as a touch PC simplify the operation of the new OSP line, which was reliably installed within the desired project framework by TSK Schill GmbH.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.