Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007
Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025

04/15/2026 | SEMI
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System

04/15/2026 | RTX
Raytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.

HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots

04/15/2026 | PRNewswire
HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in