Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Introducing the SMTA International Technical Program for Advancing Electronics Manufacturing
August 9, 2023 | SMTAEstimated reading time: 1 minute
The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 9 - 12, 2023 at the Minneapolis Convention Center in Minneapolis, MN, USA.
The four-day conference includes the latest electronics manufacturing research and technology from major manufacturers such as AMD, Cisco Systems, Collins Aerospace, Fraunhofer IZM, Honeywell FM&T, IBM Corporation, Intel Corporation, John Deere Intelligent Solutions Group, L3Harris, Nokia Bell Labs, NXP Semiconductors, Raytheon Technologies, Samsung Electronics, Skywater Technologies, several universities, and more.
90 presentations are organized into the following technical tracks:
- Advanced Packaging (APT)
- High Performance and Reliability (HPR)
- Interconnect Research and Reliability (IRR)
- Low Temperature Solder (LTS)
- Manufacturing Excellence (MFX)
- Materials for Electronics (MAT)
- Medical & Defense Symposium (MD)
- Technical Innovations (TI)
- Test and Inspection (INS)
Attendees can also choose from 11 Professional Development Courses for more in depth training. Courses are spread over the afternoons of the first three days of the conference. Topics include PCB design and fabrication processes, general manufacturing best practices, failure analysis, solder joint reliability, solder paste selection, reflow profiling, surface finishes, ESD, advanced packaging, and even Artificial Intelligence.
The annual Women’s Leadership Program is planned for Monday, October 9. This complimentary program features presentations from women leaders in the electronics and medical industries, speed mentoring sessions, closing with a connection reception.
On October 10 and 11, the SMTA International Exposition will showcase equipment and materials from electronics manufacturing technology solutions providers. In addition to SMTAI, attendees to the expo will have access to the co-located Medical Design & Manufacturing (MD&M) Minneapolis at the convention center. More than 600 exhibiting companies and over 6000 attendees are expected to participate across the six design and manufacturing shows combined, bringing together one of the largest audiences of engineering and manufacturing professionals in the Midwest.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.