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An Active, Growing PCB Industry Tilts Toward High-Complexity Leaders

05/21/2026 | Mike Carano and Thiago Guimaraes, Global Electronics Association
Recent PCB market conditions point to an industry that is active and still expanding in important segments. Demand tied to AI infrastructure, servers, high-layer-count multilayer boards, HDI, ADAS, and defense-related programs remains an important driver of the market. These segments are helping sustain momentum even as conditions in other areas remain more mixed. The result is not a uniformly rising market, but one in which enough high-value activity is flowing through to keep much of the industry on a solid footing.

Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.

Marcy’s Musings: Additive Processes, Signal Consequences

05/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Signal integrity and additive manufacturing, particularly in metallization, are defining themes in modern PCB design and fabrication. PCB layouts are meticulously engineered systems designed to meet strict electrical and power performance targets. However, achieving those targets does not end at the design stage. Once a design enters fabrication, metallization processes—the precise plating of conductive traces—play a critical role in ensuring that signal speed, reliability, and integrity are achieved in the final physical board.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
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