It’s Only Common Sense: Customers Capabilities—and Confidence
Marcy’s Musings: Operating Without a Rulebook
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
FKN Systek K5000 Singulates 10 LED strips in One Pass
August 10, 2023 | FKN SystekEstimated reading time: Less than a minute
The K5000 separates V-Scored LED strips up to 48” long. Singulate multiple V-scored PCB panels in one pass with FKN Systek K5000 PCB depanelizers. Any length panel up to 10.4" wide can be separated by placing onto an input conveyor which brings the panels into the singulation cartridge. This is the ideal system for high volume in-line singulation of LED lighting strips.
The K5000 is available as an in line system with SMEMA interface and PLC control system, or as a stand alone operator attended unit. The cutting area is protected by a see through cover to prevent access during operation. Rugged and reliable, the K5000 depaneling system has been proven in over 10 years of production with many high volume contract manufacturers. This machine will process a standard PCB in under 10 seconds, keeping up with the output from any production line. Easily singulate V-Scored Boards of up to 1 Million per year.
Separated panels are passed onto a conveyor belt or output tray. Up to 10 sets of blades can be placed side by side onto the blade cartridge. Changing blade sets for different PCB panels is done from the side of the machine and takes about 15 minutes.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.