Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
FKN Systek K5000 Singulates 10 LED strips in One Pass
August 10, 2023 | FKN SystekEstimated reading time: Less than a minute
The K5000 separates V-Scored LED strips up to 48” long. Singulate multiple V-scored PCB panels in one pass with FKN Systek K5000 PCB depanelizers. Any length panel up to 10.4" wide can be separated by placing onto an input conveyor which brings the panels into the singulation cartridge. This is the ideal system for high volume in-line singulation of LED lighting strips.
The K5000 is available as an in line system with SMEMA interface and PLC control system, or as a stand alone operator attended unit. The cutting area is protected by a see through cover to prevent access during operation. Rugged and reliable, the K5000 depaneling system has been proven in over 10 years of production with many high volume contract manufacturers. This machine will process a standard PCB in under 10 seconds, keeping up with the output from any production line. Easily singulate V-Scored Boards of up to 1 Million per year.
Separated panels are passed onto a conveyor belt or output tray. Up to 10 sets of blades can be placed side by side onto the blade cartridge. Changing blade sets for different PCB panels is done from the side of the machine and takes about 15 minutes.
Share on:
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum
11/21/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Silicon Valley Expo & Tech Forum on Thursday, December 5, 2024 at the Fremont Marriott Silicon Valley in Fremont, CA.
indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.