Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
SHENMAO Introduces Cutting-Edge Low-Temperature Lead-Free Solder Wire PF735-LT201
August 10, 2023 | SHENMAOEstimated reading time: 1 minute
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
The creation of PF735-LT201 stems from a comprehensive understanding of industry trends and challenges. With the growing demand for ultra-thin packages, the risk of package warpage increases, leading to production yield loss. SHENMAO’s innovative solution addresses this issue by offering a low-melting-point, lead-free no-clean solder wire optimized for low-temperature PCBA soldering and rework processes.
The PF735-LT201 solder wire boasts a range of exceptional features, setting a new benchmark for soldering technology. The solder wire achieves remarkable solderability by incorporating special low-temperature rosin and activators, ensuring optimal adhesion and a strong bond. The soldering process with PF735-LT201 results in colorless flux residue, thanks to the inclusion of special surfactants.
PF735-LT201 is halogen-free (ROL0) and fully compliant with RoHS, RoHS 2.0, and REACH regulations, aligning with SHENMAO’s commitment to environmental responsibility. With reduced splash and smoke during soldering, PF735-LT201 enhances the working environment while delivering excellent solder joint strength, reliability and resistance to thermal and mechanical fatigue.
SHENMAO’s LTS materials have the unique capability to reduce reflow temperatures, thereby decreasing PCB and substrate deformation. This results in improved production yield rates and elevated quality standards.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour
11/06/2025 | EssemtecEssemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.