Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Altus Group Leads the Way in Innovative Selective Soldering Equipment
August 11, 2023 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, is putting a spotlight on innovative selective soldering systems from INERTEC to enable electronics manufacturers to efficiently and profitably assemble through-hole (THT) components.
Automated assembly of THT components is a key method of manufacturing electronic devices to place and solder components onto PCBs. However, many companies face challenges in securing skilled labour and efficiently assemble THT parts to fulfil requirements for fluctuating production outputs. Selective soldering is an option that is helping many manufacturers to overcome these obstacles and balance flexibility, throughput, and profitability.
Joe Booth, Altus CEO said: "With the difficulties of conventional automation and the mix of THT parts that manufacturers face today, we believe selective soldering is an ideal technology to automate production while still allowing the flexibility that smaller batch sizes require.
“The range of systems from preeminent supplier, INERTEC Soldering Solutions provide a modular, scalable approach to upgrading soldering processes from manual methods. In particular the INERTEC Cube 460 has garnered much attention from our customers as an optimal selective soldering solution for the needs of today's electronics manufacturers."
Selective soldering delivers 4-6 times the throughput of manual soldering of THT parts over a given period with consistent quality and results. INERTEC Cube 460 is designed for small to medium production batches of THT assemblies and is effective for processing double-sided PCBs with clearance around through-hole components. This reduces tooling requirements compared to robotic soldering. The soldering angle can be programmed between 0 and 7 degrees to optimise the process for different layouts and nozzles. Switching between lead and lead-free solder is also possible within the same system.
INERTEC Cube 460 features a loading shuttle for direct assembly on the system and simplified graphical programming for quick entry into selective soldering. It provides professional capabilities found in larger selective soldering machines including process monitoring, DC servo motors, and offline software support.
Circuit boards up to 460 x 460mm are processed using quick-change, flexible soldering nozzles. The system is designed for simple setup and maintenance with excellent accessibility. Optional features like the setup carriage, electrodynamic pump, quartz preheating, process camera, and fiducial sensor provide advanced functionality to enhance process control and quality.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.